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翻訳と辞書　辞書検索 [ 開発暫定版 ] スポンサード リンク Transient liquid phase diffusion bonding ： ウィキペディア英語版 Transient liquid phase diffusion bonding Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects. The bonding technique has been exploited in a wide range of applications, from the production and repair of turbine engines in the aerospace industry to the atomic nuclear power plants〔Mazar Atabaki, M. "Microstructural evolution in the partial transient liquid phase diffusion bonding of Zircaloy-4 to stainless steel 321 using active titanium filler metal". Journal of Nuclear Materials, 406(3) (2010), 330-344〕 and the connection of circuit lines in the microelectronics industry.〔Hou, M.M., Eager, Thomas W. " Low temperature transient liquid phase (LTTLP) bonding for Au/Cu and Cu/Cu interconnections ". Journal of Electron. Package, 114(4) (1992), 443-448〕〔Mazar Atabaki, M. " Recent progress in joining of ceramic powder metallurgy products to metals". Metalurgija. 16(4) (2010), 255-268〕 ==Process== The process differs from diffusion bonding in which diffusion occurs when a melting point depressant element from an interlayer moves into lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of composition at the bond interface and the dissimilar interlayer melts at a lower temperature than the parent materials. Thus a thin layer of liquid spreads along the interface to form a joint at a lower temperature than the melting point of either of the parent materials. This method differs from brazing in that it is "isothermally solidifying". While holding the temperature above the filler metal melting point, interdiffusion shifts the composition away from eutectic, so solidification occurs at the process temperature. If sufficient interdiffusion occurs, the joint will remain solid and strong well above the original melt process temperature. This is why it is termed "transient liquid phase." The liquid solidifies before cooling. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Transient liquid phase diffusion bonding」の詳細全文を読む スポンサード リンク 翻訳と辞書 : 翻訳のためのインターネットリソース Copyright(C) kotoba.ne.jp 1997-2016. All Rights Reserved.